NVIDIA Jetson · Carrier boards · Thermal

Thor and Orin hardware for edge AI.

Haipob supplies our own Thor and Orin developer kits, carrier boards, and heatsinks alongside official NVIDIA developer kits, domain controllers, and GB10 desktop AI systems for robotics and autonomous machines.

Haipob Board
Thermal
Boardsown-product platforms
Coolingmatched thermal design

Developer kits, controllers, boards, and cooling.

Ask for a quote on any item, or tell us which interfaces, mechanics, or cooling to adapt for your device.

Self-developed Thor and Orin developer kits

Our own carrier boards, thermal design, and enclosures around NVIDIA Jetson Thor and Orin modules — ready to boot, with the module, storage, and cooling already integrated. Compare all

Official NVIDIA developer kits

Genuine NVIDIA Jetson and IGX developer kits for evaluation, software bring-up, and reference designs. Compare all

Domain controllers for autonomous vehicles and machines

Automotive- and industrial-grade compute platforms with multi-camera GMSL input, CAN, and wide-range vehicle power. Compare all

GB10 desktop AI supercomputers

NVIDIA Grace Blackwell GB10 systems from NVIDIA, MSI, and ASUS — 128 GB unified memory and up to 1 PFLOP FP4 on a desk. Compare all

Carrier and expansion boards

Carrier boards for Jetson AGX Orin, Orin NX, and Orin Nano modules, plus GMSL camera expansion boards. Interfaces can be adapted for OEM projects. Compare all

Heatsinks for Thor, AGX Orin, and Orin NX

Module-matched active cooling for sustained full-load operation. Custom heights, mounting, and airflow are available on request. Compare all

From product definition to production-ready hardware.

Share the interfaces, enclosure, temperature, power, camera count, lead time, and expected batch volume.

Self-developed BoardsCarrier boards and complete edge-computing platforms designed around real interface, power, and enclosure constraints.
Thermal SolutionsPassive and active heatsink design matched to compute load, airflow, ambient temperature, and mechanical space.
Board & System DesignInterface planning, PCB layout, power architecture, thermal design, and enclosure-ready I/O — OEM and ODM.
Small Batch to ProductionPrototype support, pilot runs, batch forecasts, documentation, and production supply coordination.

Hardware platforms for teams building real edge devices.

Robotics and AMRIndustrial visionAIoT gatewaysSmart retail terminalsMedical imaging devicesTraffic and ITS

Start with requirements, then receive a matched proposal.

Most projects get a technical answer on the first reply, not a brochure.

  1. Tell us the application, target form factor, and the interfaces you need.
  2. Add quantity range, project schedule, destination country, and compliance needs.
  3. We review the board and thermal requirements and validate feasibility.
  4. You receive a quotation, technical notes, and a sample or ODM proposal.

Tell us what your device needs to do.

The more you share about I/O, thermal conditions, quantity, and schedule, the more specific our first reply can be.

We reply within one business day. No newsletter, no third-party sharing.